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Diamond band saw for semiconductor,silicon ingot,sapphire ingot

Delivery term:The date of payment from buyers deliver within days
  • Price:

    Negotiable

  • minimum:

  • Total supply:

  • Delivery term:

    The date of payment from buyers deliver within days

  • seat:

    Beijing

  • Validity to:

    Long-term effective

  • Last update:

    2017-12-03 06:18

  • Browse the number:

    146

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Company Profile
Yangzhong Xinya Diamond Tool Factory
By certification [File Integrity]
Contact:

xydiamond(Mr.)  

Telephone:

Area:

Beijing

Address:

Second Bridge Industrial Park, Yangzhong, Jiangsu, China (212219)

Website: http://xydiamond.thorndikedaycare.com/
Product details
Model Number: L2100~L6100 Brand Name: XINYA Key Specifications/Special Features: The electroplated diamond band saw blades are used for cutting Semiconductors material, such as silicone, sapphire.The special diamond saw blades for semiconductors material have the highest sharpness and the best cutting effect. They are designed for cutting silicon ingot, sapphire ingot and more.This kind of electroplated diamond band saw have good sharpness and long lifespan, thesingle-deck on the surface of cutting part, so the cutting precision and the shape keeping performance allcan be guaranteed.In the processing of the electroplated diamond band saw, the heating temperature of the diamond is less than 100°C, so the damage to the diamond is very small, then theelectroplated diamond band saw can also have the good long lifespan.Try it, and you will love it Shipping Information: FOB Port: Shanghai
  • Lead Time: 10 - 15 days
    • Main Export Markets:
    • Asia
    • Australasia
    • Central/South America
    • Eastern Europe
    • Mid East/Africa
    • North America
    • Western Europe
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